Speciální podložní filmy a materiály (Special films and substrates)
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Nano-Tec silver coated silicon wafer Ø4inch/100mm, 525µm thickness, 10nm Ag, 3 ks/bal
Nano-Tec silver coated silicon wafer Ø3inch/76mm, 381µm thickness, 10nm Ag, 5 ks/bal
Nano-Tec silver coated silicon wafer Ø3inch/76mm, 381µm thickness, 50nm Ag, 5 ks/bal
Nano-Tec silver coated silicon wafer Ø3inch/76mm, 381µm thickness, 100nm Ag, 5 ks/bal
Nano-Tec silver coated silicon wafer Ø3inch/76mm, 381µm thickness, 500nm Ag, 5 ks/bal
Nano-Tec silver coated silicon wafer Ø4inch/100mm, 525µm thickness, 50nm Ag, 3 ks/bal
Nano-Tec silver coated silicon wafer Ø4inch/100mm, 525µm thickness, 100nm Ag, 3 ks/bal
Nano-Tec silver coated silicon wafer Ø4inch/100mm, 525µm thickness, 500nm Ag, 3 ks/bal
Nano-Tec silver coated silicon wafer Ø2inch/51mm, 275µm thickness, 10nm Ag, 9 ks/bal
Nano-Tec silver coated silicon wafer Ø2inch/51mm, 275µm thickness, 50nm Ag, 9 ks/bal
Nano-Tec silver coated silicon wafer Ø2inch/51mm, 275µm thickness, 100nm Ag, 9 ks/bal
Nano-Tec silver coated silicon wafer Ø2inch/51mm, 275µm thickness, 500nm Ag, 9 ks/bal
Nano-Tec aluminium coated silicon chips, 10 x 10mm, 525µm thickness, 100nm Al, 20ks/bal
Nano-Tec platinum coated silicon chips, 10 x 10mm, 525µm thickness, 100nm Pt, 20ks/bal
ZYB grade HOPG, 0,8° mosaic spread, double sided, 10 x 10 x 2 mm chip, 1 ks/bal
Nano-Tec titanium nitride coated silicon wafer, Ø4inch/100mm, 525µm thickness, 50nm TiN, 3 ks/bal
Nano-Tec iridium coated silicon wafer, Ø4inch/100mm, 525µm thickness, 100nm Ir, 3 ks/bal
Nano-Tec palladium coated silicon wafer, Ø4inch/100mm, 525µm thickness, 100nm Pd, 3 ks/bal
ZYA grade HOPG, 0,4° mosaic spread, double sided, 10 x 10 x 1 mm chip
ZYA grade HOPG, 0,4° mosaic spread, double sided, 10 x 10 x 2 mm chip
ZYB grade HOPG, 0,8° mosaic spread, double sided, 10 x 10 x 1 mm chip, 1 ks/bal
ZYH grade HOPG, 3,5° mosaic spread, double sided, 10 x 10 x 1 mm chip, 1 ks/bal
ZYH grade HOPG, 3,5° mosaic spread, double sided, 10 x 10 x 1 mm chip, 5 ks/bal
ZYH grade HOPG, 3,5° mosaic spread, double sided, 10 x 10 x 2 mm chip, 5 ks/bal
ZYH grade HOPG, 3,5° mosaic spread, double sided, 10 x 10 x 2 mm chip, 1 ks/bal
G3389-434 HOPG, ZYH, mozaikovitý rozptyl 3,5° ± 1,5°, 12 x 12 x 2 mm
Micro -Tec P(100) silicon wafer, ᴓ 4inch/100mm, thickness 525 um
AGS311 Boron surface for SEM/EDX, ca. 1mm² on 1cm² triangle, with adhesive (Standard)
G3337-05 Silicon aperture frame, 0,5 x 0,5mm, 10 ks/bal
G3337-10 Silicon aperture frame, 1,0 x 1,0mm, 10 ks/bal
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